The four projects presented by ATLAS at DIS'22

ATLAS research front and center at DIS鈥22

June 29, 2022

Researchers from ATLAS Institute's Unstable Design, THING, Living Matter and Superhuman Computing labs presented four papers, including three that received 鈥淗onorable Mention鈥 awards, at the ACM conference on Designing Interactive Systems (DIS '22).

An arm with illustrations added of different emotions, symbolizing the emotional effect of touch.

DIS'22: Exploring how designers approach emotional robotic touch

June 22, 2022

Prior psychology findings show humans can communicate distinct emotions solely through touch. In this award-winning work presented at DIS'22, THING Lab researchers hypothesize that similar effects might also be apply to robotic touch.

Biofoam

DIS'22: Living Matter and Unstable Design labs introduce biofoam

June 21, 2022

Exploring biofoam as a Material for Tangible Interaction, authored by Eldy S. Lazaro Vasquez, Netta Ofer, Shanel Wu, Mary Etta West, Mirela Alistar and Laura Devendorf introduced the DIS audience to biofoam, a water soluble and biodegradable material that can be made conductive.

Felt

DIS'22: An Introduction to Weave Structure for HCI

June 21, 2022

鈥淎n Introduction to Weave Structure for HCI: A How-to and Reflection on Modes of Exchange,鈥 authored by Assistant Professor Laura Devendorf, director of the Unstable Design Lab, Sasha De Koninck, an ATLAS-affiliated PhD candidate, and Etta Sandry, weaver-in-residence, received a 鈥淏est Pictorial Honorable Mention鈥 award at the ACM SIGCHI Conference on Designing Interactive Systems (DIS '22).

Knitted bubble probe

DIS '22: Exploring Stateful Textiles with People with Disabilities

June 21, 2022

鈥淜nitting Access: Exploring Stateful Textiles with People with Disabilities,鈥 authored by Annika Muehlbradt (PhD Comp. Sci鈥22) and researchers Shaun Kane, director of the Superhuman Computing Lab, Laura Devendorf director of the Unstable Design Lab, and Gregory Whiting, associate professor of mechanical engineering, won a DIS鈥22 Honorable Mention award.